TECHNICAL PARAMETERS:

Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)

Inspection type:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component: 01005.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.

Maximum Loading PCB Size(X*Y):1200x550mm.

Inspection Speed: 0.35 SEC/FOV.

Mark-point Detection Time: 0.3sec/piece.

Maximum detection height:±450um（±1200umOption）.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic shape function with static prevent warping function.

Barcode function with traceability.

Closed loop to printers.

Badmark transfer function to mounters.

Access IMS system functions.

Operating System Support: Windows 10 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.