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In-line equipment

InSPIre-630

InSPIre-630

Name: in-line 3D Solder Paste Inspection

Model: InSPIre-630

Specifications: monorail

Size: 630 x550 mm (Detection area)


Online consultation
Product Features

SPI630.jpg


TECHNICAL PARAMETERS:

Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)

Inspection type:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component size: 01005.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height:≤1um 4 Sigma;volume/acreage<1%4 Sigma.

Maximum Loading PCB Size(X*Y):630x550mm.

Inspection Speed: 0.35 SEC/FOV.

Fiducial Detection Time: 0.3sec/piece.

Maximum detection height:±450um±1200umOption.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic and static warpage compensation.

Barcode function with traceability.

Closed loop function to printers

Badmark transfer function to mounter.

Access IMS system functions.

Operating System Support: Windows 10 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.


中国领先的SPI/AOI制造商

银河澳门网址 

银河澳门网址(上海分公司)

银河澳门网址(深圳分公司)

银河澳门网址(天津办事处)

银河澳门网址(重庆办事处)

点击邮箱联系银河澳门网址:    sales@sinictek.com

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银河澳门网址的产品

3D-SPI

3D-AOI

咨询电话:400-8848-958

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