Inspection Principle: Sine white projection PMP inspection
Defect inspections: Missing parts, offset, rotation, three-dimensional polarity, upside down, OCV , side standing, tombstone, poor soldering, etc.
Solder inspection: Solder tip, solder volume percentage, excessive solder, insufficient solder, bridge, hole plugging, solder filet, pad contamination, etc.
Smallest component: 01005.
Accuracy: XY (Resolution)：10um.
Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.
Maximum Loading PCB Size(X*Y): 1200x650mm.
Inspection Speed: 0.45 SEC/FOV.
Mark-point Detection Time: 0.5sec/piece.
Maximum height of component on PCB: 50mm.
MaximumPCB Warpage: ±5mm.
Operating System Support: Windows 10 Professional (64 bit).
Equipment Dimension and weight: W1730xD1320xH1530.